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Our Advantages:
1. Program and functional test and package by Free.
2. High quality: IPC-A-610E standard, E-test, X-ray, AOI test, QC, 100% functional test.
3. Professional service: PCB/FPC/Aluminium Making, SMT, DIP, Component Sourcing, OEM with 21 years experience.
4. Certifications: UL, 94v-0, CE, SGS, FCC, RoHS, ISO9001, ISO14001,IATF16949
Advantages of single layer circuit board
(1) Low cost: The manufacturing cost of single-layer PCB board is relatively low, because only one layer of copper foil and one layer of substrate are needed, and the manufacturing process is relatively simple.
(2) Easy production: Compared with other structural types of PCB board, the production method of single-layer PCB board is relatively simple, only need to carry out single-side wiring and single-layer corrosion, so the production difficulty is low.
(3) High reliability: Single-layer PCB board does not have multi-layer wiring and connection, so it is not easy to short-circuit and interference problems, with high reliability.
(4) Suitable for simple circuit: single-layer PCB board is suitable for simple circuit design, such as LED lights, sound, etc., can meet most of the low complexity of the circuit requirements.
Material | CEM-1, CEM-3, FR-4, Aluminum, Rogers, high Tg etc. | |||||
Board thickness | Mass production: 394mil(10mm) Samples: 17.5mm | |||||
Surface finish | HASL, OSP, Immersion Gold/Silver/Tin, ENIG, Gold Finger | |||||
PCB Max panel size | 1150mm × 560mm | |||||
Layer | 1-64 L | |||||
Min hole size | Mechanical drill: 6mil(0.15mm) Laser drill: 3mil(0.075mm) | |||||
PCBA QC | X-ray, AOI Test, Functional Test,QC, QA, QE | |||||
Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Partial-hybrid, Partial high density, Back drilling, impedance requirement, and Resistance control. | |||||
Our service | PCB manufacturing, Procurement of Components, SMT/DIP PCBA assembly, Line and functional test, Installation, OEM service | |||||
Sanforized | Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control. | |||||
SMT Capacity | 700Million Points/Day, BGA 01005 | |||||
DIP Capacity | 0.5Million Points/Day | |||||
Certificate | RoHS/ISO9001/TS16949/UL/ISO14001/ISO13485 |