Qingdao Kerongda Tech Co.,Ltd.
Quality of life, reputation is the soul of the company
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SMT
SMT patch processing will purchase components according to BOM, BOM provided by customers and confirm the PMC plan of production. After the preparatory work is completed, we will start SMT programming, manufacture laser steel mesh and solder paste printing according to the SMT process.
DIP
1,The process of DIP processing is: putting in the hole →AOI→ wave soldering → cutting pin →AOI→ correction → washing → quality inspection.
2,After wave soldering, The products will be will scanned by AOI equipment to ensure that no error occurs.
| Turnkey PCBA | PCB+components sourcing+assembly+package | ||||
| Assembly details | SMT and Thru-hole, ISO lines | ||||
| Lead Time | Prototype: 15 work days. Mass order: 20~25 work days | ||||
| Testing on products | Flying Probe Test, X-ray Inspection, AOI Test, functional test | ||||
| Quantity | Min quantity: 1pcs. Prototype, small order, mass order, all OK | ||||
| Files we need | PCB: Gerber files(CAM, PCB, PCBDOC) | ||||
| Files we need | Components: Bill of Materials(BOM list) | ||||
| Files we need | Assembly: Pick-N-Place file | ||||
| PCB panel Size | Min size: 0.25*0.25 inches(6*6mm) | ||||
| Max size: 20*20 inches(500*500mm) | |||||
| PCB Solder Type | Water Soluble Solder Paste, RoHS lead free | ||||
| Components details | Passive Down to 0201 size | ||||
| Components details | BGA and VFBGA | ||||
| Components details | Leadless Chip Carriers/CSP | ||||
| Components details | Double-sided SMT Assembly | ||||
| Components details | Fine Pitch to 0.8mils | ||||
| Components details | BGA Repair and Reball | ||||
| Components details | Part Removal and Replacement | ||||
| Component package | Cut Tape,Tube,Reels,Loose Parts | ||||
| PCB assembly | Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing | ||||
